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基于封装技术的大功率白光LED光效和色温的研究

作　者: 肖勇
导　师: 李明雨
学　校: 哈尔滨工业大学
专　业: 材料加工工程
关键词: 大功率LED 光效色温封装
分类号: TN312.8
类　型: 硕士论文
年　份: 2010年
下　载: 290次
引　用: 0次
阅　读: 论文下载

内容摘要

大功率LED与传统光源相比,具有节能、寿命长、环保、体积小、响应速度快、可靠性高、调控方便等突出性能,正作为一种新型照明光源并获得越来越广泛的应用。但是大功率LED同时也存在发光效率低和色温偏高的发展瓶颈。本文制备了不同参数的荧光粉胶饼,设计了不同镀层材料的反光杯,采用两种荧光粉远离芯片结构对LED进行了封装。并通过电子衍射分析仪(XRD)、光学显微镜、拉曼光谱分析仪、积分球和PMS-50增强型光谱分析系统表征了荧光粉的相成分、荧光粉胶饼的光学性能以及LED的光效和色温等参数。在制作荧光粉胶饼的过程中,面临着两个主要的问题:荧光粉沉淀和荧光粉团聚。通过对荧光粉胶饼的金相组织观察发现超声振动对于荧光粉分散的均匀性有很显著的效果。而超声振动和真空脱泡则有助于减少荧光粉胶饼中的气泡,改善其光学性能和出光均匀性。通过对荧光粉胶饼进行拉曼光谱分析得出结论:325nm紫外光激发时,随着荧光粉胶饼厚度的增加,黄光的光通量也随之增加;而在黄色荧光粉中加入一定比例的红色荧光粉,会使白光LED的光效下降而色温升高。对制备完成的荧光粉片采用两种荧光粉远离芯片封装结构进行封装,通过积分球和PMS-50增强型光谱分析系统对不同参数的LED的光效、色温和色坐标等参数进行了测量。测量结果表明,荧光粉远离芯片封装结构与传统封装方法相比,能够提高功率型白光LED的流明效率,并且能够降低色温。黄色荧光粉浓度为15.0%,荧光粉胶饼厚度为300μm时,LED出光性能较好,光效达到60.86lm/W,色温为6187。关于大功率LED光效和色温的改善是大功率LED发展历程,特别是商品化过程中的一个重要内容。由于封装很大程度决定了LED的光学性能,本课题的研究对大功率LED封装具有重要的实用价值。

全文目录

摘要  4-6
ABSTRACT  6-8
Acknowledgements  8-12
Nomenclature  12-13
List Of Tables  13-15
List Of figures  15-18
Introduction  18-34
  1.1 Preface  18-30
    1.1.1 Development of lighting  18-19
    1.1.2 LEDs advantages  19-20
    1.1.3 LEDs applications  20-21
    1.1.4 Lighting principle of LEDs  21-25
    1.1.5 Packaging materials of LEDs  25-26
    1.1.6 Structure of white LEDs  26-28
    1.1.7 Color temperature  28-30
  1.2 The status quo for study on light efficiency and color temperature of high power LEDs  30-32
  1.3 Research significance and content  32-34
Experimental Materials and Methods  34-40
  2.1 Experimental materials  34-36
    2.1.1 Phosphor  34-35
    2.1.2 Organic silicon casting glue  35
    2.1.3 Chip  35-36
  2.2 Experimental apparatus and equipment  36
  2.3 Property characterization  36-40
    2.3.1 X-ray diffracted ray (XRD)  36-38
    2.3.2 Raman spectroscopy  38
    2.3.3 Text of light efficiency and color temperature of LEDs  38-40
Preparation of Phosphor Compound Film and Test on Its Relevant Performance  40-53
  3.1 Preface  40
  3.2 XRD phase component analysis of phosphor  40-42
  3.3 Preparation of phosphor compound film  42-44
  3.4 Dispersion uniformity of phosphor  44-48
    3.4.1 Phosphor sedimentation  45
    3.4.2 Particle agglomeration of phosphor  45-48
  3.5 Optical metallographic observe of phosphor compound film  48-49
  3.6 Raman spectrum analysis of phosphor compound film  49-51
  3.7 Chapter summary  51-53
Packaging and Performance Test of LEDs  53-70
  4.1 Preface  53-54
  4.2 Light reflector  54
  4.3 Structure and packaging flow of LEDs  54-57
    4.3.1 Dispensing  54-56
    4.3.2 Packaging structure that phosphor isolates from the chip  56-57
  4.4 Experimental results and discussion  57-68
    4.4.1 Influence of different packaging structures on the light efficiency and color temperature of white LEDs  57-59
    4.4.2 Influence of different phosphor on the light efficiency and color temperature of white LEDs  59-60
    4.4.3 Influence of phosphor compound film thickness and phosphor concentration on the light efficiency and color temperature of white LEDs  60-61
    4.4.4 Influence of the one to add the red phosphor on the light efficiency and color temperature of white LEDs  61-65
    4.4.5 Influence of material of light reflector on the light efficiency and color temperature of white LEDs  65-67
    4.4.6 Influence of material of light reflector on the light efficiency and color temperature of white LEDs  67-68
  4.5 Chapter summary  68-70
Conclusion  70-72
References  72-75

基于封装技术的大功率白光LED光效和色温的研究

内容摘要

全文目录

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